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| MITSUBISHI LSIs PRELIMINARY Notice : This is not a final specification. Some parametric limits are subject to change. 33,554,432-BIT (4,194,304-WORD BY 8-BIT / 2,097,152-WORD BY16-BIT) CMOS 3.3V-ONLY, BLOCK ERASE FLASH MEMORY M5M29GB/T320WG DESCRIPTION The MITSUBISHI Mobile FLASH M5M29GB/T320WG are 3.3V-only high speed 33,554,432-bit CMOS boot block Flash Memories with alternating BGO (Back Ground Operation) feature. The BGO feature of the device allows Program or Erase operations to be performed in one bank while the device simultaneously allows Read operations to be performed on the other bank. This BGO feature is suitable for mobile and personal computing, and communication products. The M5M29GB/T320WG are fabricated by CMOS technology for the peripheral circuits and DINOR(Divided bit line NOR) architecture for the memory cells, and are available in 6 x 8 balls CSP(0.8mm ball pitch) . FEATURES Organization ................................. 2,097,152 word x 16bit ................................. 4,194,304 word x 8 bit Boot Block M5M29GB320WG M5M29GT320WG ........................ Bottom Boot ........................ Top Boot Supply voltage ................................ Access time .............................. VCC = 2.7 ~ 3.6V .............................. 80ns (Vcc=3.0~3.6V) 90ns (Vcc=2.7~3.6V) Power Dissipation ................................. 72 mW (Max. at 5MHz) Read (After Automatic Power saving) .......... 0.33W (typ.) Program/Erase ................................. 126mW (Max.) ................................. 0.33W (typ.) Standby Deep power down mode ....................... 0.33W (typ.) Auto program for Bank(I) and Bank(II) Program Time ................................. 4ms (typ.) Program Unit (Byte Program) ......................... 1word/1byte (Page Program) ......................... 128word/256byte Auto program for Bank(III) and Bank(IV) Program Time ................................. 4ms (typ.) ................................. 128word/256byte Program Unit Auto Erase ................................. 40 ms (typ.) Erase time Erase Unit Bank(I) Boot Block ..................... 4Kword/8Kbyte x 2 Parameter Block .............. 4Kword/8Kbyte x 6 Main Block ...................... 32Kword/64Kbyte x 7 Bank(II) Main Block ...................... 32Kword/64Kbyte x 8 Bank(III) Main Block ...................... 32Kword/64Kbyte x 24 Bank(IV) Main Block ...................... 32Kword/64Kbyte x 24 Program/Erase cycles ......................................... 100Kcycles Other Functions Soft Ware Command Control Selective Block Lock Erase Suspend/Resume Program Suspend/Resume Status Register Read Alternating Back Ground Program/Erase Operation Between Bank(I) ,Bank(II),Bank(III) and Bank(IV) Package 8mm x 10mm CSP (Chip Scale Package) 6 x 8 balls, 0.8mm ball pitch APPLICATION Code Strage Digital Cellular Phone Telecommunication Mobile Computing Machine PDA (Personal Digital Assistance) Car Navigation System Video Game Machine PIN CONFIGURATION (TOP VIEW) 8.0mm INDEX A B C D E F G H A3 A7 RY/BY# WE# A9 A13 A4 A17 WP# RP# A8 A12 A2 A6 A18 NC A10 A14 A1 A5 A20 A19 A11 A15 A0 DQ0 DQ2 DQ5 DQ7 A16 CE# DQ8 DQ10 DQ12 DQ14 BYTE# OE# DQ9 DQ11 VCC DQ13 DQ15 /A-1 GND DQ1 DQ3 DQ4 DQ6 GND Outline 48pin CSP (0.8mm ball pitch) 1 2 3 4 5 6 NC : NO CONNECTION 1 Rev.0.2_48a_bazz MITSUBISHI LSIs PRELIMINARY Notice : This is not a final specification. Some parametric limits are subject to change. 33,554,432-BIT (4,194,304-WORD BY 8-BIT / 2,097,152-WORD BY16-BIT) CMOS 3.3V-ONLY, BLOCK ERASE FLASH MEMORY M5M29GB/T320WG Keep safety first in your circuit designs! -Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them.Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii)prevention against any malfunction or mishap. Notes regarding these materials -These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application;they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. -Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. -All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com). -When using any or all of the information contained in these materials, including product data, diagrams charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. -Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. -The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. -If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. -Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. Copyright 2002 Mitsubishi Electric Corporation. All rights reserved. Rev.0.2_48a_bazz |
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